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《科学前沿报告会》 第409期

科学前沿报告会(409)

报告题目

Integrated Silicon Photonic Systems and Applications

报 告 人

Professor Rena Huang

Electrical, Computer, and System Engineering Department, Rensselaer Polytechnic Institute

报告地点

物理楼 中215

报告时间

2018年1月2日 (星期二) 10:00-11:30

联 系 人

施可彬 (Tel: 6276 8959)

报告摘要

Significant research and development in the Si photonics field have been done in the past two decades. The technology advancement includes hybrid laser diodes on Si platform, integrated PN junction electro-optic ring/disk resonator or Mach-Zehnder (MZ) light modulators, SiGe on Si photodetectors, GaN low loss waveguides, integrated optical delay line, array waveguide gratings etc. There are Si photonics fabrication facilities having been established worldwide such IP-IMI in the United States and the IME in Singapore. The research and founding of manufacture facilities for Si photonics technology also stimulated many new applications: optical interconnects with wavelength division multiplexing for high performance computers and data centers, integrated RF photonic systems, photonic neuromorphic computing network and integrated lab-on-a-chip sensors. In this talk, a brief overview will be given for the integrated Si photonics technology. The research projects carried on at Dr. Huang’s Advanced Photonics Lab will also been discussed.

 

报告人简介:Dr. Huang received her B.Sc. from Beijing Institute of Technology and her Ph.D. in Electrical Engineering from Georgia Institute of Technology. Prior to joining RPI, she worked as a postdoctoral fellow at the NSF Microsystem Packaging Center at Georgia Tech where she led the effort of end-to-end optical interconnects on printed circuit boards. Dr. Huang now is an Associate Professor at the Electrical, Computer, and System Engineering Department at RPI. She has co-authored more than 60 journal articles and conference proceedings. She received the Best Poster PRC Award (2nd place) in 1999, Outstanding Poster Paper Award of 53th ECTC in 2003, Commendable Paper Award of IEEE Transaction in Advanced Packaging in 2004, and NSF RampUp Award in 2010.

 

 

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